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Focus on RF ASIC and ATCXO die, VCO and PA module RF substrate development for RFID & SRD RF markets. Commitment to low-cost methods and keeping NRE minimal gives an extremely low cost model for RF battery-powered ICs in moderate production volumes.
Services Offered:SDL execute top-level system design, bottom level schematic entry, circuit verification by simulation and physical layout. We support software development for system test and production diagnostics as well as evaluation PCB creation. Bipolar, BiCMOS and bulk CMOS experienced, we offer the following: * MPW access through foundry partnerships: XFAB, MOSIS and Europractice * Entry-level die development cost (inc. NRE & CAD tools) * Application substrate design and dedicated production test development * Delivery: GDSII 8-12wks, DXF 2-4wks, samples + 6-8wks * Supported tools: WinSpice3, Sonnet, Electric, Magic and WinLASI * COT tools: Hspice, Spectre, Virtuoso, Composer, Artist and Diva * Full RF evaluation Lab at our disposal.
Awards/Ratings/Associations:LPRA - Low Power Radio Authority (EU) MNT - Micro and Nanaotech Manufacturing Initiative (UK DTI) IEEE - Institute of Electrical and Electronics Enagineers (US) IET - Institution of Engineering and Technology (UK)
Operating Since:2000